Frontline PCB Solutions announces the release of version 2.08.5 of its InPlanTM engineering system, on February 20, 2006.
InPlan version 2.08.5 contains new functionality and enhancements mainly related to multi part engineering. In addition, new drafting functionality and flexibility is available for panel and stackup drawing, while dynamic panel design speeds up the panel design process. Other enhancements have been made in stackup design and Traveler generation, as well as usability improvements in several areas of the system. Significant accelerators have been embedded for the panel and stackup implementation process.
Highlights of version 2.08.5 include:
Multi part support across InPlan
Via on via support
New Traveler functionality including manual notes and images
Panel design innovations including:
Deep gold plating support in edge connector placement on panels
Copy panel from another job
Panel design is faster with dynamic sized panels
Panel dimensions in mm and inches on the same drawing
